In today’s pursuit of slimmer, lighter and highly‑integrated electronics, R‑FPC (Rigid‑Flexible Printed Circuit) is transforming conventional interconnection. More than a hardware upgrade, it is an innovative solution merging the structural stability of rigid PCBs and the bendable properties of FPCs.
Manufactured via precision lamination, R‑FPC bonds FR‑4‑based rigid sections with PI‑film flexible segments. This hybrid structure delivers both the mechanical strength of rigid boards and the bendability of flexible circuits, supporting complex 3D layouts and high‑density, reliable connections inside compact devices.
Adopting R‑FPC brings distinct product benefits: it cuts internal space consumption to enable slim, compact designs; outstanding anti‑vibration and anti‑torsion performance improves durability under harsh environments and extends service life; advanced production processes also secure stable signal transmission and boost overall system reliability.
As an essential core component for high‑end electronics, R‑FPC is widely applied in smartphones, tablets, laptops, precision medical devices and automotive electronics. Gradually replacing standalone rigid or flexible boards, it drives electronic products toward better performance, miniaturization and higher reliability. Beyond circuit stacking, R‑FPC embodies integrated design and engineering expertise to deliver differentiated value for your products.
SQ Advanced Interconnect Berhad (SQAI), parent firm of Malaysia’s Qdos Group and China’s Suiwa Group, is a pioneering maker of FPC and IC substrates.
Equipped with three fully automated advanced factories, we provide one-stop FPC & ICS services covering design, prototyping, mass production and assembly. Quality, on-time delivery and premium service fuel our sustainable growth.
Committed to superior FPC & ICS technology, SQAI partners with leading global OEMs. Our products cater to telecommunication, consumer electronics, automotive, medical, semiconductor and industrial sectors, serving over 20 countries such as the US, Germany and Japan.
Leveraging the national momentum of the Dual Carbon initiative, green manufacturing has become the mainstream trend across the industry.
Suiwa’s distributed photovoltaic project was successfully connected to the grid in February 2026. Covering an area of 2,500 square meters, the project adopts an integrated solar canopy design equipped with Huawei smart inverters and Aiko BC high-efficiency modules, operating on the model of self-consumption of generated power with surplus electricity fed into the grid.
Beyond cutting energy consumption and operational costs within the plant, the photovoltaic project enables the company to meet low-carbon procurement requirements of global customers and build differentiated competitive strengths.
Generating power from sunlight and advancing along a low-carbon path, Suiwa consistently fuels its long-term development with green energy.
On January 10, 2025, Suiwa held its 20th Anniversary Celebration at Xiamen Wutong Baixiang Hotel. Datuk Wong Thien Leong, Group Chairman of the Board, Mr. Wong Sin Han, Managing Director, and Mr. Liu Anzhou, Group Partner & General Manager of Suiwa, distinguished government guests at all levels to witness this historic moment. Suppliers, partners from all sectors and all employees were also invited to gather at the grand event. This celebration not only looks back on Suiwa brilliant achievements over the years, but also embodies bright expectations for its future development.
