0.4mm pitch
BGA pads
QFP IC and
Components
Traceability QR code
Cross-sectioned
via hole
High density of SMD pads
UL marking
Blind &Buried Vias
Cu Filling
On Blind Vias
Fine Pitch
Width/Space
30um/30um
V-CUT
Cross-sectioned
via hole
Brown-oxidation
Acute Registration
of LPISM ±40um
| 双面软板 Double sided flex |
汽车中控系统 Automotive infotainment system |
| QFN & BGA IC加底部填充胶 IC with underfilled glues |
| 空板+打件+功能测试一站式服务 FPCA+FCT one stop solution |
UL 796F & UL94VTM-0 |
制程能力 Manufacturing Capabilities | 标准 Standard | 先进 Advanced | |
层数 | Layer Count (circuit layers) | 1 to 8 layers | ＞8 layers |
初始铜厚 | Base Copper Thickness | 1/4oz - 2oz | 2um - 7oz |
最小线宽线距和公差 | Min.trace/space (Cu:6~9um） | 35±10um | 25±5um |
Min.trace/space (Cu:12um) | 35±10um | 28±5um | |
Min.trace/space (Cu:18um) | 45±15um | 30±6um | |
Min.trace/space (Cu:35um) | 100±20um | 70±15um | |
蚀刻因子： 2*铜厚/(底宽-顶宽) | Etching Factor： 2H/（Wb-Wt） | ＞3 *限制条件 Subject to conditions | ＞5 *限制条件 Subject to conditions |
最小通孔孔径/焊盘 | Min.Via/PAD | 0.05/0.15mm | 0.03/0.10mm |
线路与钻孔对位精度 | Image and hole registration | ±0.075mm | ±0.030mm |
阻焊油墨精度 | Solder Mask Registration | ±0.06mm | ±0.04mm |
最小阻焊油墨桥 | Min. Solder Mask Bridge | 0.08mm | 0.07mm |
最小阻焊油墨开口 | Min.Solder Mask Opening | 0.32mm × 0.32mm | 0.25mm × 0.25mm |
字符印刷精度 | Legend Pringting Registration | ±0.30mm | ±0.10mm |
补强/双面胶贴合公差 | Stiffener/PSA Reg.Tolerance | ±0.25mm | ±0.15mm |
金手指到外形边 距离公差 | Golden Finger to edge tolerance | ±0.07mm | ±0.05mm |
阻抗控制 | Impedance Control | +/-10% | +/-7.5% |
化学镍金 | ENIG | 镍Ni:40u＂-360u＂ 金Au:1u＂-4u＂ | 镍Ni:40u＂-80u＂ 金Au:2u＂-4u＂ |
电镀镍金 （硬金和软金） | Electrolytic Nickel & Gold (Soft Gold & Hard Gold) | 镍Ni:40u＂-500u＂ 金Au:1u＂-12u＂ | 镍Ni:80u＂-200u＂ 金Au:≤60u＂ |
电镀直金（软金） | Direct Gold Plating (Soft) | 12u" - 28 u＂ | ≤60u＂ |
化学沉锡 | Immersion Tin（Sn） | 10u＂-40u＂ | NA |
化学沉银 | Immersion Silver（Ag） | 3u＂- 15u＂ | 5u＂-12u＂ |
有机助焊保护剂 （抗氧化） | OSP(Anti-Oxidation) | 4u＂- 26u＂ | 8u＂-16u＂ |
UL 796F（全UL认证） | UL 796F（Full UL） | 单面板/双面板/多层板/软硬结合板 Single sided/Double sided/ Muti-layered/Rigid-flex | |
UL 94V-0(阻燃) UL 94VTM-0(阻燃) | UL 94V-0(Flame Retardant) UL 94VTM-0(Flame Retardant) | 单面板/双面板/多层板/镂空板/ 软硬结合板/双面硬板 Single sided/Double sided/Muti-layered/Bare-back flex/Rigid-flex/ Double sided Rigid | |
| 8层软硬结合板 8-layered rigid-flex |
工控 Industrial |
高玻璃转化温度材料 High Tg material |
棕化处理 Brown-oxidation |
微割处理 V-CUT |
6层软板 6-layered flex |
| 人工智能 Artificial Intelligence |
尺寸Size： 800mm*20mm |
黑色阻焊油墨 Black LPISM |
阻抗控制 Impedance control:100±10Ω |
我们的参考标准 Our Workmanship Reference | |
IPC-JPCA-6202 单双面挠性印刷板的性能手册 Single and Double sided flexible printed board performance manual | IPC-6011 印制板通用性能规范 Generic Performance Specification forPrinted Boards |
IPC-6012D 刚性印制板鉴定及性能规范 Qualification and Performance Specification for Rigid Printed Boards | IPC-6013D 挠性印制板鉴定及性能规范 Qualification and Performance Specification for Flexible Printed Boards |
JIS C5016-1994 柔性印制电路板的实验方法 Test Method For Flexible Print Circuit Board | IPC-TM-650 实验方法手册 Manual Of Experimental Methods |
IPC-A-600J 印制电路板的允收标准 Acceptability of Printed Boards | IPC-A-610F 电子组件的可接受性要求 Acceptability Requirements For Electronic Components |
IPC-4552 用于印制板的非电镀镍/浸金(ENIG)镀规范 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards | IPC-4553 用于印制板的浸银镀规范 Specification for Immersion Silver Plating for Printed Circuit Boards |
IPC-4554 用于印制板的浸锡镀规范 Specification for Tin Plating for Printed Circuit Boards | J-STD-003 印制板的可焊性测试 Solderability Tests for Printed Boards |
IPC-9252 未组装印制板电气测试要求 Requirements for Electrical Testing of Unpopulated Printed Boards | |
| 4层HDI软板 4-layered HDI flex |
医疗 Medical |
线宽/间距 Width/Space: 0.03/0.03mm |
盲孔与埋孔 Blind & Buried Microvias |
铜厚及公差 Copper thickness and tolerance：6±2um |
UL 796F & UL94V-0 |
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