材料类型

Material Type

制造商

Vendor

颜色

Color

无胶柔性覆铜板 2L FCCL

台虹Taiflex、生益Shengyi、新扬Thinflex、松下Panasonic、杜邦Dupont、新日铁NSCC

琥珀Amber透明Transparent
有胶柔性覆铜板 3L FCCL

台虹Taiflex、生益Shengyi、杜邦Dupont

琥珀Amber
保护膜 CL

台虹Taiflex、生益Shengyi、杜邦Dupont、韩华Hanwha

琥珀Amber黑色Black白色White
覆铜板 CCL

生益Shengyi、南亚Nanya、伊索拉Isola、罗杰斯Rogers

白色Whtie黄色Yellow黑色Black、棕色Brown

阻焊油墨 Soldermask

太阳Taiyo、日保丽NPT、新东方New east

绿色Green、橙色Orange、蓝色Blue、

白色White、黑色Black

纯胶粘结片 Bonding Sheet

台虹Taiflex、杜邦Dupont、华烁Haiso、东溢Dongyi

白色White
带基材粘结片 Bondply杜邦Dupont琥珀Amber
半固化片 Prepreg

斗山Doosan、生益Shengyi、伊索拉Isola、南亚Nanya

白色Whtie、黄色Yellow



层Layer类型type
制造商Vendor

厚度Thickness

导体

Conductor

压延RA、高延展性压延HA

日矿JX、福田Fukuda、奥林Olin

6um~6oz

电解ED、高温延伸电解HTE

三井Mitsui、古河Furukara

长春CCP、南亚Nanya

2um~5oz

铜镍合金 Copper-Nickel

汉密尔顿HPM、Special metals

待定 TBD

Adhesive

亚克力Acrylic、环氧Epoxy

台虹Taiflex、杜邦Dupont、华烁Haiso、

东溢Dongyi

10um~100um

基底或绝缘介质层

Base

or

Dielectric

聚酰亚胺PI

杜邦Dupont、达迈TaimideSKC、钟渊Kaneka

0.5mil~5mil

热塑性聚酰亚胺TPI

改性聚酰亚胺MPI

钟渊Kaneka、宇部UBE、杜邦Dupont

0.5mil~7mil

聚萘二甲酸乙二醇酯PEN

杜邦Dupont待定 TBD

聚对苯二甲酸乙二醇酯PET

杜邦Dupont1~4mil
聚四氟乙烯PTFE杜邦Dupont2~4mil
液晶聚合物LCP可乐丽Kuraray2~4mil
主材类型 Types of Main materials
Coverlay

Profile Features

Polyimide

Liquid/Epoxy

Liquid/ Polyimde

Flexibility

Good

Short life

Good

Heat Resistance

High

Low

High

Electrical Properties

Good

*

*

Registration Accuracy

High

Low

Very high

Technical Hurdle

High

High

Very High

Storage Condition

Room Temp.

Refrigerator

Freezer

Cost

High

Low

High


       Highlighted materials are the most common type and more economic.
A coverlay system should have solder dam capability and also strong circuit protection capability to withstand long flexing life. The selection of coverlay material must be accorded to performance requirements.
A balanced construction of identical dielectric material is ideal for positioning all the circuits pattern in a mechanically neutral zone.
Obviously, screen printed epoxy or liquid photoimagable covercoat is the least expensive method of circuit protection but is less robust than the bonded coverlay equivalent.
* - Subject to anufacturer
Copper Foil
TypeFeatures
Electro-deposited(ED) Copper foilGeneral application,suitable for static or low flexing requirements
Roll-annealed(RA) Copper foilHigh flexing ability,suitable for dynamic application


Copper is sandwiched between dielectric base material and coverlay, the identical circuits protection materials position the circuits pattern in a mechanically neutral zone.

Rolled annealed (RA) copper is recommended for high dynamic application such as optical pick-up head, printer head and disk drive because of its superb flexural endurance characteristic.

It should be borne in mind that most flexible circuits are customised three dimensional interconnection systems with one-time fixing and do not require high flexural endurance. Therefore Electro-deposited Copper (E.D. copper) is adequate for most applications. Another alternative copper type which is gaining popularity is the use of Dyncamically Flexing ED Foils, or DF ED. It offers typically more controllable etch rates and straighter trace walls which is sometimes compatible to RA foils with lower cost.

The selection of copper type will depend on the current carrying and other electrical requirements of the circuit. Conductor materials other than copper are also available. Other conductor materials are available such as aluminium, nickel, nichrome and beryllium copper.

While these other materials are available, their use is very rarely called for.

Adhesive

Material Name

Application

Features

Acrylic(Thermal set)

Suitable for SMT, reflow and greater bonding strength required areas, also used for multi-layer flex lamination.

Resist high temperature, high adhesiveness,heat lamination required

PSA(Pressure Sensitive Adhesive)

General application such as stiffener attachment.

Low heat resistance,no heat lamination required,more cost effective

PSA(resist heat)

To replace Acrylic for better process control

PSA with better heat resistance


      Various adhesive systems available for copper foil lamination to based material; coverlay lamination; stiffener lamination and heat sink lamination depending on heat resistance, flexural endurance, bonding strength and etc. PSA (Double sided tape) can be attached to flex with liner, remove the liner only upon installation to casing or other flex assembly.

The use of a pressure sensitive adhesive is often worth consideration if product cost is an important factor and where the performance requirements permit.

Stiffener

Material Name

Application

Features

FR4(Fire Retardant 4 Hours)   

For component mounting or insertion,resist high temperature(reflow)

Suitable for SMT with high dimensional stability

FR2(Fire Retardant 2 hours)

For component mounting or insertion, resist high temperature (reflow)

Suitable for SMT with high dimensional stability

   PI(Polyimide Stiffener)

For component mounting or insertion,resist high temperature(reflow)

Suitable for SMT and ZIF connectors with high dimensional stability

PET(Polyester Stiffener)

For ZIF connector insertion

Lower heat resistance,not fit for SMT or reflow

Stiffener is used to rigidize the selective areas of FPC in order to enable electronic components insertion or mounting.Other usage including thickness adjustment to suit ZIF(Zero Insertion Force)connectors.


POLYESTER
Polyester is a relatively inexpensive material compared with Polyimide. With a upper operating temperature limit of 80¡ãC and a maximum short temperature duration of 150¡ãC, this material has good electrical and mechanical properties with low thermal expansion rate at low and normal temperatures.
Upper heat resistance limitation of 150¡ãC generally restricts its use to applications where mechanical connections are made for soldered joints. Soldering can cause delamination, and requires a high degree of skill with the soldering iron. Direct contact with the heated iron will shrink or melt the material. Apart from its low cost, the greatest advantage of polyester is in common with other thermo plastic materials.
Polyester is not a suitable material for multilayer flex and reflow process but they are fit for antenna coil of smart card application.

POLYIMIDE
(RAW MATERIAL FOR COVERLAY, BASED MATERIAL & POLYIMIDE STIFFENER)
The combination of polyimide film and a high temperature thermo-setting resin adhesive produces a flexible system having excellent mechanical and electrical properties and is substantially unaffected by temperature change. Heat applied during manufacture and subsequent reflow or soldering processes tends to increase the adherence rather than weakening the conductors.
   Although the adhesives used do not have the same temperature properties as the polyimide film itself, the construction offers a continuous operating temperature of 150C and a maximum short duration temperature of 300C Subject to material type). Polyimide has a low thermal expansion (0.02-0.04mmC-1m-1)and very high tensile strength (1.69MNm-2) and is compatible with conventional epoxy-glass laminates. Thus, polyimide is applicable for rigid/flexible combinations and to multilayer applications using both plated through hole and clearance layer techniques.
   Polyimide thermoset is readily hand, dip or wave soldered and it can be unsoldered and resoldered many times. Before wave or dip soldering it is desirable to oven bake for one hour at 80Celsius to 110Celsius. The most commonly used thicknesses are 12.5 microns(0.0005") and 25 microns (0.001") and 50 microns (0.002"); other thicknesses are available.
This material can be used in the majority of applications, is obtainable in a flame retardant grade and is highly recommended.

CONTACT US
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TEL:0592-5905553
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Phone:0086-592-5920000
Add:No.1776,Lvling Road,Xiamen,Fujian,China
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