CAPABILITIES & WORKMANSHIP STANDARDS
技术能力&参考标准
瑞华高科专业于型号多,高难度,高品质要求的柔性电路板,软硬结合板,SMT组装的柔板模组,可以无缝连接快板到大量生产。我司拥有镭射激光直接成像,光学检测,激光切割,SMT表面贴装,飞针,化工物理专业实验室,瑞华高科能够满足客户的快板需求。
We are specialized into high mix,high complexity and high quality fpc,rigid-flex boards and FPC assembly.Seamlessly linking quick prototype fabrication to mass production.Equiped with sophisticated machine like LDI,AOI,lasers,SMT,flying probes,chemistry and physics laboratories etc.,Suiwa,can deliver quick-turn samples.

0.4mm pitch BGA pads

QFP  IC  and Components

Traceability QR code

Cross-sectioned via hole

High density of SMD pads

UL marking

Blind &Buried  Vias

Cu Filling On Blind Vias

Fine Pitch Width/Space 30um/30um

V-CUT

Cross-sectioned via hole

Brown-oxidation

Acute Registration

of LPISM ±40um


双面软板

Double sided flex

汽车中控系统

Automotive infotainment systemm

QFN & BGA IC加底部填充胶

IC with underfilled glues

空板+打件+功能测试一站式服务

FPCA+FCT one stop solution

UL 796F & UL94VTM-0





制程能力

Manufacturing Capabilities

标准

Standard

先进

Advanced

层数

Layer Count (circuit layers)

1 to 8 layers

>8 layers

初始铜厚

Base Copper Thickness

1/4oz - 2oz

2um - 7oz

最小线宽线距和公差

Min.trace/space (Cu:6~9um)

35±10um

25±5um


Min.trace/space (Cu:12um)
35±10um
28±5um

Min.trace/space (Cu:18um)
45±15um
30±6um

Min.trace/space (Cu:35um)
100±20um
70±15um

蚀刻因子:

2*铜厚/(底宽-顶宽)

Etching Factor:   

2H/(Wb-Wt)

>3 *限制条件

Subject to

conditions

>5 *限制条件

Subject to

conditions

最小通孔孔径/焊盘

Min.Via/PAD

0.05/0.15mm

0.03/0.10mm

线路与钻孔对位精度

Image and hole registration

±0.075mm

±0.030mm

阻焊油墨精度

Solder Mask Registration

±0.06mm

±0.04mm

最小阻焊油墨桥

Min. Solder Mask Bridge

0.08mm

0.07mm

最小阻焊油墨开口

Min.Solder Mask Opening

0.32mm × 0.32mm

0.25mm × 0.25mm

字符印刷精度

Legend Pringting Registration

±0.30mm

±0.10mm

补强/双面胶贴合公差

Stiffener/PSA Reg.Tolerance

±0.25mm

±0.15mm

金手指到外形边

距离公差

Golden Finger to edge

tolerance

±0.07mm

±0.05mm

阻抗控制

Impedance Control

+/-10%

+/-7.5%

化学镍金

ENIG

镍Ni:40u"-360u

金Au:1u"-4u"

镍Ni:40u"-80u

金Au:2u"-4u"

电镀镍金

硬金和软金)

Electrolytic Nickel & Gold

(Soft Gold & Hard Gold)

镍Ni:40u"-500u"

金Au:1u"-12u"

镍Ni:80u"-200u

金Au:≤60u"

电镀直金(软金)

Direct Gold Plating (Soft)

12u" - 28 u"

≤60u"

化学沉锡

Immersion Tin(Sn

10u"-40u"

NA

化学沉银

Immersion Silver(Ag)

3u"- 15u"

5u"-12u"

有机助焊保护剂

(抗氧化)

OSP(Anti-Oxidation)

4u"- 26u"

8u"-16u"

UL 796F(全UL认证)

UL 796F(Full UL)

单面板/双面板/多层板/软硬结合板

Single sided/Double sided/

Muti-layered/Rigid-flex

UL 94V-0(阻燃)   

UL 94VTM-0(阻燃)

UL 94V-0(Flame Retardant)

UL 94VTM-0(Flame Retardant)

单面板/双面板/多层板/镂空板/

软硬结合板/双面硬板

Single sided/Double sided/Muti-layered/Bare-back flex/Rigid-flex/

Double sided Rigid





8层软硬结合板

8-layered rigid-flex

工控

Industrial

高玻璃转化温度材料

High Tg material

棕化处理

Brown-oxidation

微割处理

V-CUT





6层软

6-layered flex
人工智能

Artificial Intelligence

尺寸Size:

800mm*20mm

黑色阻焊油墨

Black LPISM

阻抗控制

Impedance control:100±10Ω








我们的参考标准

Our Workmanship Reference

IPC-JPCA-6202

单双面挠性印刷板的性能手册

Single and Double sided flexible printed

board performance manual

IPC-6011

印制板通用性能规范

Generic Performance Specification for Printed Boards

IPC-6012D

刚性印制板鉴定及性能规范

Qualification and Performance Specification

for Rigid Printed Boards

IPC-6013D   

挠性印制板鉴定及性能规

Qualification and Performance

Specification for Flexible Printed Boards

JIS C5016-1994

柔性印制电路板的实验方法

Test Method For Flexible Print Circuit Board

IPC-TM-650

实验方法手册

Manual Of Experimental Methods

IPC-A-600J

印制电路板的允收标准

Acceptability of Printed Boards

IPC-A-610F

电子组件的可接受性要求

Acceptability Requirements For

Electronic Components

IPC-4552

用于印制板的非电镀镍/浸金(ENIG)镀规范

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

IPC-4553

用于印制板的浸银镀规范

Specification for Immersion Silver

Plating for Printed Circuit Boards

IPC-4554

用于印制板的浸锡镀规范

Specification for Tin Plating for Printed

Circuit Boards

J-STD-003

印制板的可焊性测试

Solderability Tests for Printed Boards

IPC-9252

未组装印制板电气测试要求

Requirements for Electrical Testing of

Unpopulated Printed Boards






4层HDI软板

4-layered HDI flex

医疗

Medical

线宽/间距

Width/Space: 0.03/0.03mm

盲孔与埋孔

Blind & Buried Microvias

铜厚及公差

Copper thickness and tolerance:6±2um

UL 796F & UL94V-0




CONTACT US
Recruitment
TEL:0592-5905553
Official WeChat
Phone:0086-592-5920000
Add:No.1776,Lvling Road,Xiamen,Fujian,China
Purchasing
TEL:0592-5905791
Sales:
(Chinese): 0086-592-5905781,5905789 (English): 0086-592-5905531,5905788 (Japanese): 0086-592-5905785,5905777