📌 Core Features
Upgraded Materials: Low Dk/Df low-loss PI / LCP substrates, ultra-low profile HVLP/RA copper foils to reduce attenuation of high-frequency signals.
Key Electrical Performance: Controlled Impedance. Typical differential pairs at 100Ω and single-ended 50Ω with tight impedance tolerance (±5% or even stricter). It supports high-speed protocols including MIPI, PCIe, USB3.x and DP, with data rates over 10Gbps; premium versions can reach 25Gbps and 56Gbps.
High Process Barriers: Fine line width & space, laser micro blind vias, multi-layer structure, optional shielding layers for EMI suppression. Some are Rigid-Flex FPC (R-FPC), with guaranteed bending reliability.
What “High-end” means: Not ordinary consumer-grade FPC. It adopts higher standards in materials, yield rate, reliability and environmental tests, applied to high-value equipment.
📱 Typical Applications
Foldable smartphones, high-end tablets for high-speed display & camera connections
Internal high-speed flexible interconnection for servers, optical modules and AI accelerator cards
Automotive ADAS, automotive high-definition screens, LiDAR
5G/6G RF modules, medical imaging equipment, high-end industrial cameras.