★ 18µm / 18µm

Ultra fine line / gap by advanced etching technology.

★ ±25µm

Circuit and via hole registration tolerance, LDI technology.

★ ±30µm

Liquid photoimageable solder mask registration tolerance, DI technology.

★ 18µm / 18µm

Ultra fine line / gap by advanced etching technology.

★ ±25µm

Circuit and via hole registration tolerance, LDI technology.

★ ±30µm

Liquid photoimageable solder mask registration tolerance, DI technology.