Application: Digital Camera
Category: Double-sided FPC
Thickness: 0.08mm
Min.Line/Space: 100um/75um
Min.Via/Land: 0.15mm/0.4mm
Surface Finish: ENIG
Features: Orange CVL; PI & SUS stiffener; PSA with blue release liner
Special requirement: UL796F
Application: CT Detectors
Category: Double-sided FPC
Thickness: 0.12 mm
Min.Line/Space: 60 μm / 60 μm
Minimum Via / Land: 0.25 mm / 0.45 mm
Surface Finish: Electrolytic Nickel gold(Soft gold>0.75mm）
Features:
TOP:Orange LPISM; Orange coverlay; TG>200°C black FR4 stiffener
Special Requirements: For SMT; ACF bonding; Gold wire bonding
Application: Automotive Ambient Lighting
Category: Double sided FPC
Layer Count & Structure: 2L (1.2m length)
Thickness: 0.25mm
Min.Line/Space: 300um/300um
Min.Via/Land: 0.4mm/0.9mm
Surface Finish: ENIG
Features: Orange coverlay; Assembled with LED & IC drivers
Special Requirement: IPC CLASS 3 1.2m length
Application: Semiconductor Device
Category: Double-sided FPC
Thickness: 0.08mm
Min.Line/Space: 100um/100um
Min.Via/Land: 0.2mm/0.45mm
Surface Finish: ENIG
Features: Orange CVL & LPISM
Special Requirement: Ultra thin FCCL; Very slender branch
Application: Digital Camera
Category: Double-sided FPC
Thickness: 0.08mm
Min.Line/Space: 100um/75um
Min.Via/Land: 0.15mm/0.4mm
Surface Finish: ENIG
Features: Orange CVL; PI & SUS stiffener; PSA with blue release liner
Special requirement: UL796F
Application: Automotive Miniled Display
Category: Double-sided FPC
Thickness: 0.18mm
Min.Line/Space: 60um/35um
Min.Via/Land: 0.035mm/0.15mm
Surface Finish: ENIG
Features: Black CVL; LPISM; PI & SUS stiffener; Assembled with driver ICs & thousands of MiniLEDs
Special Requirement: ±30um LPISM registration; Very small solder pads
Application: ICE Catheter
Category: Double-sided FPC
Layer count & Structure: 2L (1.2m length)
Thickness: 6±2um finished copper
Min.Line/Space: 45um/45um
Min.Via/Land: 0.05mm/0.2mm
Surface Finish: ENIG
Features: Orange CVL; PI stiffener
Special Requirement: R0.1mm; 180°; 10 bending cycles; 1.2m length
Application: Medical Devices
Category: Rigid-flex PCB
Layer count & Structure: 10L (1R+2R+1F+2F+1F+2R+1R)
Thickness: 1.2mm
Min.Line/Space: Rigid: 100um/100um; Flex: 35um/55um
Min.Via/Land: Rigid: 0.2m/0.6mm; Flex: 0.75mm/0.2mm
Surface Finish: ENIG
Features: Green LPISM; Orange CVL; L1~L10 PTH & L4~L7 buried via
Special Requirement: Resin plugged PTH
Application: Test Instrument
Category: Rigid-flex PCB
Layer count & Structure: 8L (1R+2F+2R+2R+1R)
Thickness: 1.6mm
Min.Line/Space: 127um/127um
Min.Via/Land: 0.3mm/0.6mm
Surface Finish: ENIG
Features: Rigid: Green LPISM; Orange CVL; V-CUT
Special Requirement: Asymmetric Mechanism
